The new leadless SMD package for CoolMOS™

ThinPAK 5x6 is a leadless SMD package especially designed for High Voltage MOSFETs.
This new package has a very small footprint of 5x6mm² (30mm² vs. 77mm² for the DPAK) and a very low profile with only 1mm height (1.0mm vs. 2.3mm for the DPAK).
This significantly smaller package size in combination with its benchmark low parasitic inductances can be used as a new and effective way to decrease system solution size in power-density driven designs. The ThinPAK 5x6 package is characterized by a very
low source inductance 1.6nH (vs. 4.7nH for DPAK), as well as a similar thermal performance as DPAK. The package hence enables faster and thus more efficient switching of Power MOSFETs and is easier to handle in terms of switching behavior and EMI.
 
Key Features                                                                                 
·    „ Small footprint (5x6mm²)
·    „ Low profile (1mm)
·    „ Low parasitic inductance
·    „ RoHS compliant
·    „ Halogen free mold compound
Key Benefits
·    „ Reduced board space consumption
·    „ Increased power density
·    „ Short commutation loop
·    „ Smooth switching waveform
·    „ Easy to use products
·    „ Environmentally friendly
Applications
·        Adapter
·    „ Consumer
·    „ Lighting
Product Portfolio for CoolMOS™ in ThinPAK 5x6